Your privacy as a member is important to us. Recently, rules surrounding privacy have changed, so we have created this manifest for you to read and accept.
It is not possible for you to be classed as an authentic member of the DCA unless you accept the terms, that includes but is not limited to the GDPR statement below.
Please read the privacy policy here.
High temperatures in electronics have always been a problem for their performance and lifespan. Historically, for electronics, fans and heatsinks were good enough. In the present times, though, the computational density required by the new digital trends (AI, Iot, Edge, ML, etc.) is getting higher and higher. The chips are required to operate at their maximum, and one of the known problems is that temperature affects their performance. Those chips can withstand high temperatures, but would not it be great to have them operating in a very comfortable environment?
Join Jaime Pita, Sr. Thermal Engineer, and Daniel Pope, CEO of Submer for our monthly educational webinar around the thermodynamics principles behind Submer’s Immersion Cooling technology.
If thermodynamics is your thing, or if you want to know more around it, download our new white paper “The Convection Principle: What it is and how it applies to Submer’s Immersion Cooling Technology” in the SmartTools section of our website. Don’t miss it!